| Compatible Brand | For Apple, For Toshiba |
|---|---|
| Brand | K5 PRO |
| Type | Thermal Compound |
| Color | White |
| Packaging | JAR |
| Material | Silicone |
| To Fit | Chipset - Northbridge, Chipset - Southbridge, GPU RAM, MOSFET, RAM |
| Country of Origin | Greece |
| UPC | 635292526527 |
Check the listing for details. K5 PRO 20g jar – DIY thermal putty for pad replacement; nonconductive. Color: White, Condition: New, Made in Greece. Listed at 15.00 USD. • 1 × 20 g jar of K5 PRO thermal putty. Beyond standard repairs, K5 PRO also solves thermaltransfer challenges in custom or compact builds. • 1 × instruction leaflet. The 20 g jar is the allaround choice for repeat repairs or multiple devices.
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